Notes
from 3/3 Meeting:
Mangra
Reviewed the possible
solutions to reduce the stress in the PF 4 coil and provide shape control in the
PF coils. The plan is to provide spring loaded clamps similar to the
current design to provide a force high enough to overcome magnetic forces to
keep coils centered through normal operating temperature scenarios.
Requires analysis by EA group to provide spring sizing.
Provided analysis of the
deflections of the OTF without the inner link and with the outer ring modified
with one end fixed, other end pinned connections. Indicates that inner
ring is not required if compliant link (aka radius rods) are used to carry some
of the OOP loads.
The plan forward:
1. Support the PF4/5 off
the existing PF4,5 supports and use 6 to 12 columns.
2. More connections from the PF4-5 coils to
limit PF 4 stress.
3. The OTF will be support using the outer
ring (1 fixed, 1 pinned end) and compliant links to clevis, which will not be
modified.
Zhang
Han presented analysis
using one of the larger scenarios, no. 79 on the OTF using the outer
ring. Scenario 79: Utheta=2.7mm (0.1”), shear in the epoxy between
coil turns is 10.7MPa (1551 psi). Load in radius rod: 32KN (7.3klbs).
Further work needs to be done with the remaining scenarios but the initial
results look good.
Titus
Presented analysis for 6 supports and 6 supports
+ 6 clamps versions of the PF 4 and 5 coils sets. Analysis indicates
safety factor in Cu is 1.25 (for 6 Supp.) and 1.64 (6 Supp. + 6 clmps).
Layer to Layer Shear Localized
Peak in PF4 is 85
MPa
for 6 supports, 44
MPa
For 6 supports and 6 Clamps and 24
MPa
for Twelve
Supports.
Sri
Dynamic stresses (from an
outer limiter disruption) in the passive plate copper are 90 t0 135 MPa (13 to
20 ksi) and 600 MPa (87 ksi) in the fasteners. The fasteners will need to
be replaced with higher strength fasteners.
Using the VDE disruption
(plasma 1 to plasma 5) stresses in the passive plate brackets are much higher at
2 GPa (290 ksi) which is well beyond conventional materials.
Neumeyer to verify this disruption as a realistic scenario.
The effort to mitigate against this scenario would be significant to
severe, possibly requiring a material change of the passive plates.
Ellis
Let a discussion on the
potential heating issues from the upgrade on the RF Limiter boron nitride tiles.
While the tiles may increase in temperature and potenitally overheat
Menard believes that we may be able to control heating by the plasma to limiter
spacing (10-12 cm). It's not clear at this time that the plasma would have
to be run close to the limiter and overheat the tiles. The decision
forward is that no action is required at this time.
Viewgraphs will be posted by B.
Simmons